|[January 16, 2019]
Molex Solutions Leading Evolution to 56 Gbps NRZ and 112 Gbps PAM-4 Signaling
a global provider of integrated electronic solutions, continues to make
strong efforts in developing leading-edge technologies for high-speed
data networking. Thanks to decades of knowledge and advanced, automated
manufacturing, Molex (News - Alert) is now offering a comprehensive portfolio of 112
Gbps solutions, which feature highly reliable technologies essential for
meeting future speed demands and expanding capacity. As more data is
generated and infrastructure moves to the cloud, Molex I/O and backplane
cabling solutions support faster processing in high-performance
computing and data center equipment. Molex is aggressively developing
new and faster solutions to support these evolving needs. While the move
to 112 Gbps has been a challenge for the overall industry, Molex has
innovative solutions that perform at peak speeds in the densest
footprints. The solutions not only meet 112 Gbps requirements, but they
support future data rate speeds without reconfiguring basic networks.
"Data centers must evolve to meet the rising demand for faster data
rates. Molex delivers highly scalable technologies equipped with
advanced features to achieve the speed, signal integrity, EMI
containment and thermal efficiencies they need to ramp up to
next-generation equipment and networking platforms," said David Brunker,
Molex technical fellow, who serves on the DesignCon 2019 Technical
In data centers and telecom infrastructure, 56 Gbps NRZ and 112 Gbps
PAM-4 speeds are some of the latest developments in serial data signal
formats. Implementation of high data rate protocols requires a clean
channel with low signal-to-noise ratios. Molex has a portfolio of five
different solutions that are capable of reaching speeds up to 112 Gbps.
These product lines include:
Quad Small Form Factor Pluggable Double Density (QSFP-DD) System
BiPass I/O and Backplane Cable Assemblies
NearStack High-Speed Connector System and Cable Jumper Assemblies
Mirror Mezz High-Speed System
Impulse Backplne Connector and Cabling System
Come speak with industry experts at DesignCon 2019, where Molex will be
showing these leading technologies for high-density channels among
several other live demos in booth 631.
In addition to the booth demos, Molex will lead a technical session,
"Exploring 56/112 Gbps Copper Interconnect Metrics Comparing Classic
Methods with COM" on January 30th at 2:00 p.m. in Ballroom C.
Molex engineers will present a study that shows full channel assessments
using Classic and COM tools with a map of their performance
intersection. These performance studies will be conducted at 56 Gbps and
112 Gbps PAM-4 data rates.
See Molex at DesignCon 2019, being held at the Santa Clara Convention
Center from January 30 - 31, 2019. To learn more about what Molex will
highlight at DesignCon 2019, please visit: www.connector.com/solutions/designcon.
To learn more about Molex 112 Gbps high-speed solutions for data center
and telecom infrastructure applications, please visit https://www.connector.com/solutions/112-gbps-high-speed-capabilities/.
Molex brings together innovation and technology to deliver electronic
solutions to customers worldwide. With a presence in more than 40
countries, Molex offers a full suite of solutions and services for many
markets, including data communications, consumer electronics, medical,
industrial, automotive, and commercial vehicle. For more information,
please visit www.molex.com.
Molex is a registered trademark of Molex, LLC in the United States of
America and may be registered in other countries; all other trademarks
listed herein belong to their respective owners.
View source version on businesswire.com: https://www.businesswire.com/news/home/20190116005760/en/
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