Microsemi Announces Availability of its RTG4 High-Speed, Radiation-Tolerant FPGA Engineering Samples in a Ceramic Quad Flat Package for Easier Integration and Qualification of Flight Systems
ALISO VIEJO, Calif., Sept. 27, 2017 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its RTG4™ high-speed signal processing radiation-tolerant field programmable gate array (FPGA) engineering samples in a ceramic quad flat pack (CQFP) package are now available. The new CQ352 package, which conforms to the CQFP industry standard for space applications, features 352 pins to enable a more cost-effective integration than higher pin count packages and is the only CQFP package available for high-speed radiation-tolerant FPGAs in its class.
As an industry standard, the CQFP package is well-known for its ability to support a variety of space flight applications, primarily due to their lower costs of integration and well-understood assembly techniques, making CQFP easier to assemble onto the printed circuit board (PCB) than ceramic column grid array (CCGA) packages. As a result, CQFP is widely respected by space customers worldwide, including its meticulous package assembly, inspection and testing processes.
"We are excited to bring one of the most popular package types for space flight applications to Microsemi's RTG4 FPGA family and provide customers a more cost-effective integration than higher pin count packages," said Minh Nguyen, senior marketing manager for space at Microsemi. "This addition to our existing CG1657 package not only enhances the overall packaging portfolio for these devices, but also demonstrates our ongoing commitment to delivering innovative solutions which enable customers to confidently evaluate and design while meeting demanding industry specifications."
The RTG4 FPGA in a CQ352 package is ideally suited to control applications which do not require a high number of inputs/outputs (I/Os), including satellites, space launch vehicles, planetary orbiters and landers and deep space probes, as well as others requiring frequent switching and a high number of temperature cycles, which can be challenging for CCGA packages. According to Euroconsult's report titled, "Satellites to be Built and Launched by 2024," 60 percent more satellites will be launched by 2024 versus the past decade. This increase is driven primarily by civilian government agencies as established space countries replace and expand their in-orbit satellite systems and more countries acquire their first operational satellite systems.
Microsemi's RTG4 FPGA in the CQ352 package features 166 3.3V general purpose I/Os, four embedded SpaceWire clock and data recovery circuits and four high-speed serialization/deserialization (SerDes) transceivers which can be used for either external physical coding sublayer (EPCS) or Peripheral Component Interconnect Express (PCIe) protocols. They also maintain the same count of look-up tables (LUTs), flip-flops, digital signal processing (DSP) math blocks and static random-access memory (SRAM) blocks as the existing CCGA package with 1,657 pins.
About Microsem's RTG4 FPGAs and Development Kit
RTG4 FPGAs bring new capabilities to the market and combine a wealth of features with the highest quality and reliability to meet the increasing demands of modern satellite payloads. The devices feature reprogrammable flash configuration, making prototyping easier for customers. RTG4's reprogrammable flash technology offers complete immunity to radiation-induced configuration upsets in the harshest radiation environments, without the configuration scrubbing required with SRAM FPGA technology. RTG4 supports space applications requiring up to 150,000 logic elements, and each includes a LUT4 and a flip-flop with built-in triple module redundancy (TMR). The devices also feature total ionizing dose (TID) beyond 100 kilorads, as well as high system performance of up to 300 MHz without single event transient (SET) mitigation.
The RTG4 Development Kit features Microsemi's Libero SoC Design Suite, offering high productivity with its comprehensive, easy to learn, easy to adopt development tools for designing with Microsemi's radiation-tolerant FPGAs. The suite integrates industry standard Synopsys SynplifyPro synthesis and Mentor Graphics ModelSim simulation with best-in-class constraints management, debug capabilities and secure production programming support.
RTG4 is Microsemi's latest development in a long history of radiation-tolerant FPGAs that are found in many NASA and international space programs. For more information, visit http://www.microsemi.com/products/fpga-soc/radtolerant-fpgas/rtg4.
Microsemi Leading Space Innovation for 60 Years
With one of the industry's most comprehensive portfolios of space products, Microsemi provides radiation-tolerant FPGAs, radiation-tolerant mixed-signal integrated circuits (ICs), radiation-hardened DC-to-DC converters, precision time and frequency solutions, linear and POL hybrids, custom hybrid solutions, and radiation-hardened discretes including the broadest portfolio of JANS Class diodes and bipolar products. Microsemi is committed to supporting its products throughout the lifetime of its customer programs. The company continues to innovate and expand its portfolio, which includes its LX7730 radiation-tolerant telemetry controller IC, the new LX7720 radiation-tolerant power driver IC with rotational and position sensing, as well as its RTG4™ high-speed signal processing radiation-tolerant FPGA family. The RTG4's reprogrammable flash technology offers complete immunity to radiation-induced configuration upsets in the harshest radiation environments, requiring no configuration scrubbing, unlike SRAM FPGA technology. For more information about Microsemi's space products, visit http://www.microsemi.com/applications/space.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California, and has approximately 4,800 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its RTG4 high-speed signal processing radiation-tolerant FPGA engineering samples in a CQFP package being available, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs in implementing the company's acquisitions and divestitures strategy or integrating acquired companies, uncertainty as to the future profitability of acquired businesses and realization of accretion from acquisition transactions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
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